发明名称 OPTICAL MODULE BONDING DEVICE AND METHOD OF MANUFACTURING OPTICAL MODULE
摘要 PROBLEM TO BE SOLVED: To provide mounting method and device of an optical module which allows for mounting while positioning a LD element mounting member, with high accuracy, for the reference of a package member.SOLUTION: A method of manufacturing an optical module includes a position adjustment step for adjusting the relative position and relative angle of a LD element mounting member and a package member, so that a beam passes through a predetermined position of the package member, while observing the beam outputted from a lens, by holding the LD element mounting member and package member separately, and emitting the beam from a semiconductor laser element by supplying a current thereto, and a bonding step for bonding the LD element mounting member and package member by means of a bonding material, while holding them separately.
申请公布号 JP2015119129(A) 申请公布日期 2015.06.25
申请号 JP20130263363 申请日期 2013.12.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 KODERA HIDEKAZU;MORITA DAISUKE;SHIMONO MASAYA
分类号 H01S5/022 主分类号 H01S5/022
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