LAMINATION SUBSTRATE AND MANUFACTURING METHOD OF THE SAME

摘要

A manufacturing method according to an embodiment of the present invention includes: a step of forming a tapered first groove on a surface of a semiconductor wafer; a step of forming a notch groove having a narrow width in a bottom portion of the first groove; a step of laminating the semiconductor wafer to a mother glass substrate using a sealing material; a step of forming a tapered second groove on a back surface of the semiconductor wafer; a step of separating a semiconductor substrate of the semiconductor wafer by cutting the semiconductor wafer from the second groove toward the notch groove; and a step of separating respective counter substrates by cutting the mother glass substrate along a scribe groove.

主权项

1. A manufacturing method for manufacturing a lamination substrate in which a first substrate part and a second substrate part are laminated together using a first mother substrate including a plurality of first substrate parts and a second mother substrate including a plurality of second substrate parts, the manufacturing method comprising:
a step of forming the first substrate part including a terminal in the first mother substrate; a step of forming a tapered first groove on a first surface provided with the terminal of the first mother substrate; a step of forming a notch groove having a width narrower than the maximum width of the first groove in a bottom portion of the first groove; a step of providing an adhesive in at least one of the first substrate part and the second substrate part; a step of laminating the first mother substrate to the second mother substrate using the adhesive such that the first surface is disposed on the side of the second mother substrate and the terminal is disposed outside the adhesive; a step of forming a tapered second groove at a position corresponding to the first groove on a second surface opposite to the first surface of the first mother substrate; a step of separating the respective first substrate parts by cutting the first mother substrate from the second groove toward the notch groove; a step of providing a scribe groove on a surface of the second mother substrate not facing the first substrate part; and a step of separating the respective second substrate parts by cutting the second mother substrate along the scribe groove.