| 摘要 |
PROBLEM TO BE SOLVED: To improve poor connection of an electronic component, while suppressing warpage of a substrate by using stage heating. ! SOLUTION: In a method of manufacturing a connection body where an electronic component 18 is connected onto a substrate 12 via an adhesive 1, by mounting a temporary connection body 21, where the electronic component 18 is mounted on the substrate 12 via an uncured adhesive 1, on a stage 31 having a temperature control mechanism 32, heating the substrate 12 side by means of the stage 31, and hot pressing the electronic component 18 onto the substrate 12 by means of a hot press head 33, the substrate 12 is preheated by means of the stage 31, prior to the hot press process by means of the hot press head 33. ! COPYRIGHT: (C)2015,JPO&INPIT |
