| 摘要 |
PROBLEM TO BE SOLVED: To allow a dicing device to be downsized.SOLUTION: A groove forming step forms a groove having a predetermined depth on a surface of a device wafer. A plate sticking step sticks a plate 20 to the surface of the device wafer via an adhesive 31. A grinding step holds the device wafer on a holding table via the plate 20 and forms a plurality of chips 15a to 15c by exposing the groove on the rear surface of the device wafer by grinding the rear surface of the exposed device wafer and dividing the device wafer. A film sticking step sticks a film to the rear surface of the device wafer. A dicing step divides the film from the rear surface 102 side along a division schedule line 13. A pickup step picks up chips 15a to 15c from the plate 20. The plate 20 has almost the same size as the device wafer 10, so upsizing of a dicing device can be suppressed even when the diameter of the device wafer 10 becomes larger. |
