| 发明名称 |
THERMALLY ENHANCED HEAT SPREADER |
| 摘要 |
A three dimensional integrated circuit (3DIC) includes a first substrate and a heat spreading structure embedded in the first substrate. The 3DIC further includes a die electrically connected to the first substrate, wherein the die is thermally connected to the heat spreading structure. The 3DIC further includes a plurality of memory units on the die, wherein the die is between the plurality of memory units and the first substrate, and the plurality of memory units is thermally connected to the heat spreading structure by the die. The 3DIC further includes an external cooling unit on the plurality of memory units, wherein the plurality of memory units is between the die and the external cooling unit, and the die is thermally connected to the external cooling unit by the plurality of memory units. |
| 申请公布号 |
US2015179617(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201514636866 |
申请日期 |
2015.03.03 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIN Po-Yao;LIN Wen-Yi;LEU Shyue Ter;YEW Ming-Chih |
| 分类号 |
H01L25/065;H01L29/16;H01L23/522;H01L23/42;H01L23/373 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A three dimensional integrated circuit (3DIC) comprising:
a first substrate; a heat spreader embedded in the first substrate; a die electrically connected to the first substrate, wherein the die is thermally connected to the heat spreader; a plurality of memory units on the die, wherein the die is between the plurality of memory units and the first substrate, and the plurality of memory units is thermally connected to the heat spreader by the die; and an external cooling unit on the plurality of memory units, wherein the plurality of memory units is between the die and the external cooling unit, and the die is thermally connected to the external cooling unit by the plurality of memory units. |
| 地址 |
Hsinchu TW |
