| 发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
A method of manufacturing a semiconductor device, includes providing a lead frame including a frame portion, including a through hole penetrating the lead frame, a device forming portion surrounded by the frame portion in plan view, including a die pad, and a semiconductor chip mounted on the die pad; after the providing step, sealing the semiconductor chip with sealing resin by supplying the sealing resin to the device forming portion via a first region of the frame portion in which the through hole is formed in plan view, thereby forming a sealing body sealing the device forming portion and the first region of the frame portion; and after the sealing step, removing a first part of the sealing body located at the first region of the frame portion from the lead frame by inserting a pin into the through hole. |
| 申请公布号 |
US2015179480(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201514634427 |
申请日期 |
2015.02.27 |
| 申请人 |
Renesas Electronics Corporation |
发明人 |
Fujii Hiroshi;Tanaka Shigeki;Yoshida Kazuaki |
| 分类号 |
H01L21/56;H01L23/29;H01L23/495;H01L23/22 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor device, comprising the steps of:
(a) providing a lead frame including:
(a1) a frame portion, including:
(a11) a through hole penetrating the lead frame,(a2) a device forming portion surrounded by the frame portion in plan view, including:
(a21) a die pad, and(a22) a semiconductor chip mounted on the die pad; (b) after the step (a), sealing the semiconductor chip with sealing resin by supplying the sealing resin to the device forming portion via a first region of the frame portion in which the through hole is formed in plan view, thereby forming a sealing body sealing the device forming portion and the first region of the frame portion; and (c) after the step (b), removing a first part of the sealing body located at the first region of the frame portion from the lead frame by inserting a pin into the through hole, wherein in plan view, the through hole has a pair of sides that extend divergently from a first end portion of the through hole toward an arcuate second end portion of the through hole such that the first end portion is located closer than the arcuate second end portion to the device forming portion. |
| 地址 |
Kawasaki-shi JP |
