Defect Discovery and Inspection Sensitivity Optimization Using Automated Classification of Corresponding Electron Beam Images

摘要

Various embodiments for classifying defects detected on a wafer are provided. One method includes acquiring an electron beam image generated by a defect review tool for a location of a defect detected on a wafer by a wafer inspection tool. The method also includes determining a classification of the defect based on at least the electron beam image and without input from a user. The method may also include feeding back the classification results to the wafer inspection tool and optimizing the parameters of the tool to maximize sensitivity to the defects of interest.

主权项

1. A computer-implemented method for classifying defects detected on a wafer, comprising:
acquiring an electron beam image generated by a defect review tool for a location of a defect detected on a wafer by a wafer inspection tool; and determining a classification of the defect based on at least the electron beam image and without input from a user, wherein said acquiring and said determining are performed using a computer system.