EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

There are provided an epoxy resin composition for encapsulation, which is particularly suitable for use in resin pre-setting type flip-chip mounting of a Cu post chip, and which is capable of suppressing defects due to the generation of voids; and a method for manufacturing a semiconductor device using a Cu post chip. The present invention provides an epoxy resin composition for semiconductor encapsulation for flip-chip mounting, which contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and 3 to 64 parts by weight, relative to 100 parts by weight of the component (A), of thermally thickening resin particles (D) having a volume-average primary particle diameter of 0.2 to 10 μm; and a method for manufacturing a semiconductor device by resin pre-setting type flip-chip mounting of a Cu post chip using the composition.

主权项

1. An epoxy resin composition for semiconductor encapsulation for flip-chip mounting, the composition containing an epoxy resin (A), a curing agent (B), a curing accelerator (C), and 3 to 64 parts by weight, relative to 100 parts by weight of the component (A), of thermally thickening resin particles (D) having a volume-average primary particle diameter of 0.2 to 10 μm.