MICROSTRUCTURES FOR IMPROVED WAFER HANDLING

摘要

Provided herein are high coefficient of friction contact surfaces for transfer of substrates including semiconductor wafers. In certain implementations, the contact surfaces include microstructures that exploit intermolecular surface forces for increased adhesion and friction in the x-y direction during substrate transfer, while allowing easy release in the z-direction without tilting the substrate. Also provided are robot end effectors including the contact surfaces and related high-throughput transfer systems and methods.

主权项

1. A contact pad for an end effector, comprising:
a contact pad base; and a plurality of structures arrayed on the contact pad base, each structure including a flexible member and a plurality of contact members connected to the flexible member, the flexible member configured to deflect on application of a substrate; and the plurality of contact members configured to adhere to a substrate by van der Waals adhesion.