Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are disclosed. In some embodiments, the flexibly-wrapped integrated circuit die device includes a substrate and a flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate.
申请公布号
WO2015094259(A1)
申请公布日期
2015.06.25
申请号
WO2013US76397
申请日期
2013.12.19
申请人
INTEL CORPORATION;ALBERS, SVEN;SKINNER, MICHAEL;BARTH, HANS-JOACHIM;BAUMGARTNER, PETER;GOSSNER, HARALD
发明人
ALBERS, SVEN;SKINNER, MICHAEL;BARTH, HANS-JOACHIM;BAUMGARTNER, PETER;GOSSNER, HARALD