| 摘要 |
A MEMS chip having at least two chip components (12, 14, 16) bonded together by means of an adhesive layer (24, 34) that is applied to at least one of two mating bonding surfaces (22, 48; 30, 54) of the two components, wherein a pattern of finely distributed micro-cavities (50) is formed in at least one of the two mating bonding surfaces (48, 54), said micro-cavities being arranged to accommodate a major part of the adhesive. |
