METHOD FOR CHIP PLACEMENT AND BONDING USING LAYOUT PAD

摘要

According to the present invention, a method to attach and place a chip by using a placement frame includes a first step of forming a groove to insert a chip by etching a position corresponding to the placement of the chip embedded in a wafer in a side of a placement frame; a second step of inserting the chip into the groove formed on the placement frame; a third step of arranging the wafer on the placement frame; a fourth step of attaching the chip to the wafer by reflowing the placement frame and wafer; and a fifth step of removing the placement frame.