| 摘要 |
PROBLEM TO BE SOLVED: To suppress warpage of a substrate, to suppress position displacement of components, and to achieve an excellent arrangement accuracy of components.SOLUTION: A method includes the following steps of: (A) vacuum-laminating a first adhesive film 10 including a first supporting body 11 and a first thermoset resin composition layer 12 bonded with the first supporting body 11, on an insulation substrate 1' provided with a cavity 1a penetrating between first and second principal surfaces; (B) temporarily bonding components on the first thermoset resin composition layer 12 in the cavity 1a; (C) vacuum-laminating a second adhesive film including a second supporting body and a second thermoset resin composition layer bonded with the second supporting body, on a second principal surface of the insulation substrate 1' at a condition that a heating temperature of the surface of the first adhesive film 10 is lower than that of the surface of the second adhesive film surface; and (D) thermally curing the first and second thermoset resin composition layers to form an insulating layer. |
