| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip resistor including an electrode structure that does not degrade even when being operated for a long period of time under high temperature of about 250 to 350°C.SOLUTION: Foundation internal electrodes 12, 13 are Ag-base thick film electrodes. In the chip resistor including an Au plating layer 20 on an outermost surface layer of an outer electrode, a metal intermediate plating layer 19 composed of a platinum group as a diffusion barrier against the Au plating layer 20 is provided. The intermediate plating layer 19 composed of a platinum group is preferably a palladium (Pd) plating layer.</p> |
