| 摘要 |
PROBLEM TO BE SOLVED: To allow a dicing device to be downsized. ! SOLUTION: A plate sticking step sticks a plate 20 to a surface of a device wafer 10 via an adhesive 31. A grinding step holds the device wafer 10 on a holding table via the plate 20 and thins the device wafer 10 to a predetermined thickness by grinding a rear surface 102 of the exposed device wafer 10 by grinding means. A dicing step forms a plurality of chips 15 by dividing the device wafer 10 from the rear surface 102 side along a division schedule line 13. A pickup step picks up each chip 15 from the plate 20. The plate 20 has almost the same size as the device wafer 10, so upsizing of a dicing device can be suppressed even when the diameter of the device wafer 10 becomes larger. ! COPYRIGHT: (C)2015,JPO&INPIT |
