发明名称 CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive particle capable of making initial connection resistance low when a connection structure is obtained by electrically connecting electrodes by the conductive particle, and capable of maintaining connection resistance low even when the connection structure is exposed in a presence of acid. ! SOLUTION: The conductive particle 1 has a substrate particle 11, a first conductive layer 12 arranged on a surface of the substrate particle 11 and formed from silver or copper, a second conducive layer 13 arranged on an outside surface of the first conductive layer 12 and formed from nickel and a plurality of core material 14 formed by an inorganic material containing no nickel, the second conductive layer 13 has a plurality of projections 13a on an outside surface, the core material 14 is arranged inside of the projections 13a and the projections 13a is formed by protuberance of the outside layer of the second conductive layer 13 by the core material 14. ! COPYRIGHT: (C)20
申请公布号 JP2015118931(A) 申请公布日期 2015.06.25
申请号 JP20140233609 申请日期 2014.11.18
申请人 SEKISUI CHEM CO LTD 发明人 O GYOKA
分类号 H01B5/00;H01B1/00;H01B1/22;H01R11/01 主分类号 H01B5/00
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