| 发明名称 |
ELECTRONIC COMPONENT MODULE AND AN ASSEMBLY INCLUDING THE SAME |
| 摘要 |
An electronic component module includes a board, a plurality of external terminals provided on a first surface of the board, and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals. The first semiconductor chip more protrudes along a normal to the first surface than ends of the external terminals do. |
| 申请公布号 |
US2015181739(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201514612271 |
申请日期 |
2015.02.02 |
| 申请人 |
PANASONIC CORPORATION |
发明人 |
FUKUDA Toshiyuki;KODERA Keisuke;ITOU Fumito;MIYOSHI Toshihiro |
| 分类号 |
H05K7/02 |
主分类号 |
H05K7/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component module, comprising:
a board; a plurality of external terminals provided on a first surface of the board; and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals, wherein the first semiconductor chip more protrudes along a normal to the first surface than ends of the external terminals do. |
| 地址 |
Osaka JP |
