| 发明名称 |
COMPONENT MOUNTING METHOD AND MOUNTING COMPONENT |
| 摘要 |
A component mounting method includes: placing a mounting component in contact with, and on top of, an electronic component on a substrate, pressing a spring member against the mounting component using a jig such that the mounting component is pushed against the electronic component by the spring member, and fixing the spring member to the substrate, and removing the jig in a direction heading away from a mounting face of the substrate after the spring member has been fixed to the substrate. |
| 申请公布号 |
US2015181721(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201414552620 |
申请日期 |
2014.11.25 |
| 申请人 |
FUJITSU LIMITED ;FUJITSU TELECOM NETWORKS LIMITED |
发明人 |
HAYAMA Junichi;Tsutsumi Kenji;Inoue Takashi;Shouyama Hiroyuki;Hirano Makoto;Ishikawa Kenji |
| 分类号 |
H05K3/30 |
主分类号 |
H05K3/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A component mounting method, comprising:
placing a mounting component in contact with, and on top of, an electronic component on a substrate; pressing a spring member against the mounting component using a jig such that the mounting component is pushed against the electronic component by the spring member, and fixing the spring member to the substrate; and removing the jig in a direction heading away from a mounting face of the substrate after the spring member has been fixed to the substrate. |
| 地址 |
Kawasaki-shi JP |
