| 发明名称 |
MICRO-WIRE CONNECTION PAD |
| 摘要 |
A connection-pad structure includes a substrate and a An electrical conductor including a plurality of micro-wires form an electrically continuous connection pad on or in the substrate. An electrical connector is electrically connected to the electrical conductor. |
| 申请公布号 |
US2015181702(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201514640458 |
申请日期 |
2015.03.06 |
| 申请人 |
Eastman Kodak Company |
发明人 |
Cok Ronald Steven;Trauernicht David Paul |
| 分类号 |
H05K1/02;H05K1/09 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A connection-pad structure, comprising:
a substrate; an electrical conductor including a plurality of electrically connected micro-wires forming a connection pad physically associated with the substrate; and an electrical connector electrically connected to the connection pad. |
| 地址 |
Rochester, NY US |
