INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES

摘要

An integrated device die and package is disclosed. The integrated device die includes a unitary body. The unitary body can have an upper portion comprising one or more active components. The upper portion can have first and second opposing lateral sides defining at least a portion of a periphery of the upper portion such that an upper surface of the upper portion is disposed between upper edges of the first and second opposing lateral sides. The unitary body can also have a lower portion monolithically formed with the upper portion. The lower portion can comprise a pedestal extending downwardly from the upper portion. The pedestal can be laterally inset from lower edges of the first and second opposing lateral sides. The pedestal can include a distal end portion configured to couple to a carrier.

主权项

1. An integrated device package comprising:
a carrier; and an integrated device die mounted to the carrier, the integrated device die comprising a unitary body comprising a pedestal and first and second overhang regions, the first and second overhang regions monolithically formed with a proximal end portion of the pedestal, the first overhang region and the second overhang region disposed on opposing sides of the pedestal such that the pedestal is laterally inset from lateral edges of each of the first and second overhang regions, wherein the pedestal comprises a distal portion attached to the carrier.