EMBEDDED HEAT SPREADER WITH ELECTRICAL PROPERTIES

摘要

Embodiments of the invention relate to incorporating one or more antennas or inductor coils into a semi-conductor package. A heat spreader or metal sheet is embedded in the package and stamped or otherwise patterned into a spiral or serpentine form. The pattern enables the spreader to function as an inductor or antenna when connected to a semiconductor chip in communication with a printed circuit board.

主权项

1. A semiconductor package comprising:
a semiconductor chip, the chip having a first surface and an oppositely disposed second surface, the first surface in communication with a substrate; a heat spreader disposed to be vertically adjacent to the chip and electrically connected thereto, the spreader having a first surface and an oppositely disposed second surface, the first surface of the spreader in electrical communication with the second surface of the chip; and a non-conductive compound sealing the chip within an enclosure and in communication with the spreader.