| 摘要 |
<p>A method for calibrating the marking position of a wafer marking apparatus includes a power control step, a first emission step, a first acquisition step, a calculation step, and a position compensation step. In the power control step, the power of a laser beam outputted from a laser output unit is controlled to preset calibration power. In the first emission step, a laser beam sensing unit attached on a wafer holder is moved in one position of the marking region by using a holder driving unit and the laser beam is emitted to the laser beam sensing unit by controlling a galvanometer scanner. In the first acquisition step, the image and the emission position of the laser beam sensed in the laser beam sensing unit are acquired. In the calculation step, position deviation between the center of the laser beam sensing unit and the emission position of the laser beam in the laser beam sensing unit is calculated. In the position compensation step, the emission position of the laser beam is compensated by inputting the position deviation to the galvanometer scanner to emit the laser beam to the center of the laser beam sensing unit.</p> |
