发明名称 ACTIVE REGIONS WITH COMPATIBLE DIELECTRIC LAYERS
摘要 A method to form a semiconductor structure with an active region and a compatible dielectric layer is described. In one embodiment, a semiconductor structure has a dielectric layer comprised of an oxide of a first semiconductor material, wherein a second (and compositionally different) semiconductor material is formed between the dielectric layer and the first semiconductor material. In another embodiment, a portion of the second semiconductor material is replaced with a third semiconductor material in order to impart uniaxial strain to the lattice structure of the second semiconductor material.
申请公布号 US2015179742(A1) 申请公布日期 2015.06.25
申请号 US201514624530 申请日期 2015.02.17
申请人 Ranade Pushkar 发明人 Ranade Pushkar
分类号 H01L29/165;H01L29/423;H01L29/51;H01L29/417;H01L21/3105;H01L29/267;H01L21/02;H01L29/66 主分类号 H01L29/165
代理机构 代理人
主权项 1. A method of making a semiconductor structure comprising: forming a substrate comprising a first semiconductor material; forming a dielectric layer above said substrate, wherein said dielectric layer comprises a layer of oxide of said first semiconductor material directly above said substrate; removing a portion of said substrate to form a trench between said dielectric layer and the remaining portion of said substrate; and forming an active region in said trench, wherein said active region comprises a second semiconductor material, wherein the composition of said second semiconductor material is different from that of said first semiconductor material, and wherein said active region is formed directly between said dielectric layer and the remaining portion of said substrate.
地址 Hillsboro OR US