发明名称 |
Molded Electronic Structures in Body-Mountable Devices |
摘要 |
Molded electronic structures configured for use in body-mountable devices and methods for embedding molded electronic structures in a body-mountable device are described. An example method may include molding an electronic structure to have first curvature corresponding to a first radius of curvature. The electronic structure may include an antenna, a sensor, and an electronic device. The example method may also include adhering the molded electronic structure to a first polymer layer. The example method may additionally include forming a second polymer layer over the molded electronic structure adhered to the first polymer layer. |
申请公布号 |
US2015173602(A1) |
申请公布日期 |
2015.06.25 |
申请号 |
US201314139865 |
申请日期 |
2013.12.23 |
申请人 |
Google Inc. |
发明人 |
Barrows Daniel Patrick;Liu Zenghe;Linherdt Jeffrey George;Etzkorn James |
分类号 |
A61B3/10;A61B5/1477 |
主分类号 |
A61B3/10 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method comprising:
molding an electronic structure to have a first curvature corresponding to a first radius of curvature, wherein the electronic structure comprises at least one antenna, a sensor, and an electronic device; adhering the molded electronic structure to a first polymer layer; and forming a second polymer layer over the molded electronic structure adhered to the first polymer layer. |
地址 |
Mountain View CA US |