发明名称 Molded Electronic Structures in Body-Mountable Devices
摘要 Molded electronic structures configured for use in body-mountable devices and methods for embedding molded electronic structures in a body-mountable device are described. An example method may include molding an electronic structure to have first curvature corresponding to a first radius of curvature. The electronic structure may include an antenna, a sensor, and an electronic device. The example method may also include adhering the molded electronic structure to a first polymer layer. The example method may additionally include forming a second polymer layer over the molded electronic structure adhered to the first polymer layer.
申请公布号 US2015173602(A1) 申请公布日期 2015.06.25
申请号 US201314139865 申请日期 2013.12.23
申请人 Google Inc. 发明人 Barrows Daniel Patrick;Liu Zenghe;Linherdt Jeffrey George;Etzkorn James
分类号 A61B3/10;A61B5/1477 主分类号 A61B3/10
代理机构 代理人
主权项 1. A method comprising: molding an electronic structure to have a first curvature corresponding to a first radius of curvature, wherein the electronic structure comprises at least one antenna, a sensor, and an electronic device; adhering the molded electronic structure to a first polymer layer; and forming a second polymer layer over the molded electronic structure adhered to the first polymer layer.
地址 Mountain View CA US
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