| 摘要 |
Provided is a light-emitting device capable of high-density mounting by means of flip chip mounting, and that has high reliability of light quantity. A wiring pattern has: a cathode pattern and an anode pattern deposed maintaining a predetermined gap; and a parallel connection pattern disposed between the anode pattern and cathode pattern maintaining a predetermined gap from both patterns. In the anode pattern and the parallel connection pattern, a plurality of light-emitting elements are mounted in a manner such that anode electrodes are connected to the anode pattern and cathode electrodes are connected to the parallel connection pattern, in the parallel connection pattern and cathode pattern, a plurality of light-emitting elements are mounted in a manner so that anode electrodes are connected to the parallel connection pattern and cathode electrodes are connected to the cathode pattern, and each of the light-emitting elements are connected in series and in parallel to another adjacent light-emitting element by means of the wiring pattern. |
