| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can efficiently perform wiring of a wiring board on which a semiconductor device is mounted. ! SOLUTION: A power module 3 comprises a first supply terminal P1, a second supply terminal N1, an output terminal OUT1, a first gate terminal G1 and a second gate terminal G2, which are formed on a top face of the power module 3. The first supply terminal P1, the second supply terminal N1 and the output terminal OUT1 are arranged on the top face of the power module 3 next to each other in an X direction. The second supply terminal N1 is arranged on a central part in an x direction of the top face of the power module 3. The first supply terminal P1 is arranged on the top face of the power module 3 in a region between an edge of the top face on an -x direction side and the second supply terminal N1. The output terminal OUT1 is arranged on the top face of the power module 3 in a region between an edge of the top face on an +x direction side and the second |
