发明名称 WAFER HOUSING CASSETTE
摘要 PROBLEM TO BE SOLVED: To provide a wafer housing cassette which can be folded when a wafer is not housed therein. ! SOLUTION: A wafer housing cassette comprises: a first lateral plate 2 provided therein with a plurality of support grooves 21 for supporting a wafer; a second lateral plate 3 arranged parallel to the first lateral plate with a predetermined distance; a base plate 4 for coupling the lower end of the first lateral plate to the lower end of the second lateral plate; a top plate 5 for coupling the upper end of the first lateral plate to the upper end of the second lateral plate; a back plate 6 arranged between the rear end of the top plate and the rear end of the base plate; and a take-in/take-out opening provided on the front end side of the first lateral plate, the second lateral plate, the base plate and the top plate. The lower end portion of the first lateral plate is rotatably coupled to one lateral portion of the base plate, while the lower end portion of the second lateral plate is coupl
申请公布号 JP2015119026(A) 申请公布日期 2015.06.25
申请号 JP20130261166 申请日期 2013.12.18
申请人 DISCO ABRASIVE SYST LTD 发明人 DAII AKIJI
分类号 H01L21/673 主分类号 H01L21/673
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