MOUNTING STRUCTURE AND METHOD FOR SUPPLYING REINFORCING RESIN MATERIAL

摘要

A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure 1, a substrate 2 and an electronic component 4 raised on the substrate 2 are joined with bonding metal 3 and a reinforcing resin body 5 is bonded to the substrate 2 and the electronic component 4. The reinforcing resin body 5 includes a plurality of reinforcing resin layers 5a. The reinforcing resin layers 5a constituting the reinforcing resin body 5 are stacked in the height direction of the raised electronic component 4 along a side 4a of the electronic component 4 so as to be raised from the substrate 2.

主权项

1. A mounting structure comprising:
a substrate; an electronic component mounted on the substrate so as to be raised on the substrate joined to the electronic component with bonding metal; and at least one reinforcing resin body bonded to the substrate and the electronic component, the at least one reinforcing resin body including a plurality of reinforcing resin layers, the at least one reinforcing resin body being configured such that the reinforcing resin layers are stacked in a height direction of the raised electronic component so as to be raised from the substrate along a side of the electronic component.