SEMICONDUCTOR CHIPS HAVING HEAT CONDUCTIVE LAYER WITH VIAS

摘要

A heat conductive layer is deposited on a first surface of a wafer of semiconductor chips. The heat conductive layer is etched to form vias that expose through-electrodes on the first surface of each semiconductor chip. Conductive bumps are deposited on the through-electrodes on a second surface of each semiconductor chip. The semiconductor chips are stacked, wherein the conductive bumps of a second one of the semiconductor chips electrically contact the through-electrodes of a first one of the semiconductor chips through the vias of the first semiconductor chip and the conductive bumps of a third one of the semiconductor chips electrically contact the through-electrodes of the second semiconductor chip through the vias of the second semiconductor chip.

主权项

1. A semiconductor package, comprising:
a substrate having a first surface, a second surface opposing the first surface, and first bonding pads disposed on the second surface; a first semiconductor chip having a third surface facing the second surface of the substrate, a fourth surface opposing the third surface, and first through-electrodes extending between the third and fourth surfaces, wherein respective ones of the first through-electrodes correspond to, and are electrically connected to, respective ones of the first bonding pads; a first heat conductive layer plated onto the fourth surface, thereby providing a fifth surface; a first insulating layer formed on the first heat conductive layer fifth surface, thereby providing a sixth surface, wherein the first heat conductive layer and first insulating layer form first vias, respective ones of the first vias surrounding respective ones of the first through-electrodes; and a second semiconductor chip having a seventh surface facing the sixth surface of the first insulating layer of the first semiconductor chip, an eighth surface opposing the seventh surface, and second through-electrodes extending between the seventh and eighth surfaces, wherein respective ones of the second through-electrodes correspond to, and have electrical connections through the first vias to, respective ones of the first through-electrodes of the first semiconductor chip.