METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

A method for producing a semiconductor device having a semiconductor element obtained by dividing a semiconductor wafer comprises a temporary securing step of arranging a temporary securing film between a support member and the semiconductor wafer so as to temporarily secure the support member and the semiconductor wafer to each other; a grinding step of grinding a surface on the side opposite from the temporary securing film of the semiconductor wafer temporarily secured to the support member, and a semiconductor wafer peeling step of peeling the temporary securing film from the ground semiconductor wafer, wherein a semiconductor wafer edge-trimmed on an outer peripheral part of a surface opposing the support member is used as the semiconductor wafer, and the temporary securing step arranges the temporary securing film on the inside of the edge-trimmed part.

主权项

1. A method for producing a semiconductor device comprising a semiconductor element obtained by dividing a semiconductor wafer, the method comprising:
a temporary securing step of arranging a temporary securing film between a support member and the semiconductor wafer so as to temporarily secure the support member and the semiconductor wafer to each other; a grinding step of grinding a surface on the side opposite from the temporary securing film of the semiconductor wafer temporarily secured to the support member; and a semiconductor wafer peeling step of peeling the temporary securing film from the ground semiconductor wafer; wherein a semiconductor wafer edge-trimmed on an outer peripheral part of a surface opposing the support member is used as the semiconductor wafer; and wherein the temporary securing step arranges the temporary securing film on the inside of the edge-trimmed part.