| 摘要 |
<p>This invention relates to a silicone resin and a method of preparing the same, wherein the silicone resin is maintained in high hardness even upon low-temperature curing while overcoming limitations of properties (heat resistance/light resistance, hardness and adhesion at high temperature and high humidity) of an organic resin (an acryl-epoxy resin) for displays and semiconductors requiring high specifications, thus achieving cost savings, favorably protecting the device from scratching in subsequent processes in the presence of a layer formed thereby, and keeping high adhesion to a substrate even at high temperature and high humidity, ultimately making it useful to manufacture a protective layer for displays and semiconductor devices.</p> |
