| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure which has excellent reliability and suitable for high integration.SOLUTION: A semiconductor device comprises: a first substrate having a first distribution line; a second substrate which is arranged opposite to the first substrate and includes a second distribution line connected with the first distribution line via a connection terminal and has an area smaller than that of the first substrate; a first resin layer which is filled in a gap between the first substrate and the second substrate and covers a region on the first substrate around the second substrate; an organic film pattern which is provided on the first substrate to surround the resin layer; and a second resin layer which covers the first substrate, the organic film pattern, the resin layer and the second substrate. |
