METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO MICROELECTRONIC SUBSTRATE INTERCONNECTION STRUCTURES

摘要

Embodiments of the present description include methods for attaching a microelectronic device to a microelectronic substrate with interconnection structures after disposing of an underfill material on the microelectronic device, wherein filler particless within the underfill material may be repelled away from the interconnection structures prior to connecting the microelectronic device to the microelectronic structure. These methods may include inducing a charge on the interconnection structures and may include placing the interconnection structures between opposing plates and producing a bias between the opposing plates after depositing the underfill material on the interconnection structures.

主权项

1. A method, comprising:
providing a microelectronic device having an active surface and an opposing back surface with at least one interconnection structure extending from the microelectronic device active surface; disposing an underfill material over the microelectronic device active surface and the at least one microelectronic device interconnection structure, wherein the underfill material includes filler particles dispersed within a carrier material; and repelling the filler particles from the at least one microelectronic device interconnection structure by positioning at least one first metal plate proximate the microelectronic device active surface and at least one second metal place proximate the microelectronic device back surface and inducing a bias between the plates, wherein each microelectronic device interconnection structure is position between its respective patterned first metal plate and patterned second metal plate.