SOLDERING NOZZLE FOR DELIVERING MOLTEN SOLDER TO THE UNDERSIDE OF A PCB, METHOD OF REDUCING THE RATE OF OCCURRENCE OF DEWETTING OF A SOLDER NOZZLE

摘要

A soldering nozzle for delivering molten solder to the underside of a PCB. The nozzle comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle having an outer surface configured to collect a return flow of molten solder. The outer surface of the nozzle comprises a slotted or recessed feature located about at least a part of the nozzle outlet. This feature is for accommodating at least a part of the return flow of molten solder. The soldering nozzle of the present invention achieves an improved dewetting performance.

主权项

1. A soldering nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, and the nozzle having an outer surface configured to support a return flow of molten solder, the nozzle also being adapted to release excess molten solder by having defined therein at least one aperture through which an excess of molten solder can be released.