| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor device manufactured by connecting a terminal and a circuit by metal bonding, which can reduce the number of man-hour in assembly by making aligning for connecting the terminal and the circuit easy and enables inspection such as a visual check after metal bonding.SOLUTION: In a power semiconductor device having a current conduction part at the center, a transistor which has a terminal insertion part in a case top and, when viewed from above, a terminal connection part is not hidden by the case top is used. |
