| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding method in which judgement on a thickness of a workpiece of a wafer etc. under grinding can be made more certain. ! SOLUTION: A grinding method, in which a workpiece is ground to a specified finishing thickness, includes: a grinding process in which the workpiece held at a chuck table is ground; a rotation number detection process in which the rotation number of the chuck table in the grinding process is detected; a measurement time calculation process in which a time needed for one rotation of the chuck table is calculated; and a thickness measurement process in which a thickness of the workpiece is measured continuously for the time calculated in the measurement time calculation process. And, the measurement data measured in the thickness measurement process is compared with a finishing thickness of the workpiece stored beforehand in memory means, and it is determined whether the workpiece is ground to the finishing thickness. In a case of a positive determinat |
