| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal diffusion material capable of suppressing temperature rise of the housing surface and occurrence of hot spots, while ensuring extremely easy mounting work on the housing, and excellent adhesion thereto, and to provide an electronic component having such a thermal diffusion material and excellent in assembly workability. ! SOLUTION: A thermal diffusion material has a heat conduction suppression layer and a high heat conduction layer. The heat conduction suppression layer contains hollow fine particles including a hollow part and a surface layer. The surface layer contains a resin component as a main component, and has a heat conductivity of 0.07 W/m K or less measured by the steady method. ! COPYRIGHT: (C)2015,JPO&INPIT |
