发明名称 |
PROCESS FOR FORMING A PLANAR DIODE USING ONE MASK |
摘要 |
A planar diode and method of making the same employing only one mask. The diode is formed by coating a substrate with an oxide, removing a central portion of the oxide to define a window through which dopants are diffused. The substrate is given a Ni/Au plating to provide ohmic contact surfaces, and the oxide on the periphery of the window is coated with a polyimide passivating agent overlying the P/N junction. |
申请公布号 |
US2015179824(A1) |
申请公布日期 |
2015.06.25 |
申请号 |
US201514608742 |
申请日期 |
2015.01.29 |
申请人 |
Vishay General Semiconductor LLC |
发明人 |
Wang Benson;Lu Kevin;Chiang Warren;Chen Max |
分类号 |
H01L29/861;H01L23/31;H01L29/167 |
主分类号 |
H01L29/861 |
代理机构 |
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代理人 |
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主权项 |
1. A diode comprising:
(a) a substrate of a first conductivity type and a doped region of a second conductivity type defining a P/N junction therebetween; (b) nickel plating on the underside of the substrate and along a central portion of a top side of the substrate overlying the doped region of the second conductivity type; (c) an oxide coating on the peripheral portion of the top side of the substrate adjacent the central portion; and (d) a coating of a passivating material along the oxide on the top side of the substrate, the passivating material extending partially over the P/N junction. |
地址 |
Hauppauge NY US |