| 发明名称 |
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES PROVIDING THERMOELECTRIC COOLING AND METHODS FOR COOLING SUCH INTEGRATED CIRCUIT STRUCTURES |
| 摘要 |
Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures are disclosed. In one exemplary embodiment, a three-dimensional integrated circuit structure includes a plurality of integrated circuit chips stacked one on top of another to form a three-dimensional chip stack, a thermoelectric cooling daisy chain comprising a plurality of vias electrically connected in series with one another formed surrounding the three-dimensional chip stack, a thermoelectric cooling plate electrically connected in series with the thermoelectric cooling daisy chain, and a heat sink physically connected with the thermoelectric cooling plate. |
| 申请公布号 |
US2015179543(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201314138593 |
申请日期 |
2013.12.23 |
| 申请人 |
GLOBALFOUNDRIES Singapore Pte. Ltd. |
发明人 |
Tan Juan Boon;Liu Wei;Tee Kheng Chok;Chew Kam Chew |
| 分类号 |
H01L23/38;H01L23/367;H01L25/065;H01L23/48 |
主分类号 |
H01L23/38 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A three-dimensional integrated circuit structure comprising:
a plurality of integrated circuit chips stacked one on top of another to form a three-dimensional chip stack; a thermoelectric cooling daisy chain comprising a plurality of vias electrically connected in series with one another formed surrounding the three-dimensional chip stack; a thermoelectric cooling plate electrically connected in series with the thermoelectric cooling daisy chain; and a heat sink physically connected with the thermoelectric cooling plate. |
| 地址 |
Singapore SG |
