| 发明名称 |
SEMICONDUCTOR WAFER TRANSFER JIG |
| 摘要 |
The semiconductor wafer conveying tool which can realize the uniform heating to a surface of a semiconductor wafer when heating the semiconductor wafer is a semiconductor wafer conveying tool which holds the semiconductor wafer having a predetermined diameter to convey it wherein the tool is provided with a main body having an opening with a diameter which is larger than a diameter of the semiconductor wafer, and at least three supporting members each having a predetermined length, containing plural pins which are arranged corresponding to the diameter of the semiconductor wafer and being configured to be a holding mechanism for holding the semiconductor wafer concentrically at a projection position from an inner periphery portion of the main body around the opening, as shown in FIG. 1. |
| 申请公布号 |
US2015179496(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201314416532 |
申请日期 |
2013.07.25 |
| 申请人 |
Senju Metal lndustry Co., Ltd. |
发明人 |
Mutsuji Toshihiko;Nagata Kaname |
| 分类号 |
H01L21/687 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor wafer conveying tool which can hold a semiconductor wafer having a predetermined diameter to convey it when heating the semiconductor, characterized in that the tool is provided with:
a main body having an opening with a diameter which is larger than a diameter of the semiconductor wafer; and at least three supporting members each having a predetermined length, containing plural pins which are arranged corresponding to the diameter of the semiconductor wafer and are different in their heights and being installed into the main body, wherein the supporting member constitutes a holding mechanism for holding the semiconductor wafer concentrically by the pins at a projection position from an inner periphery portion of the main body around the opening. |
| 地址 |
Tokyo JP |
