Method and arrangement for attaching a chip to a printed conductive surface

摘要

A chip (201) is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip (205, 206).