发明名称 PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a processing device that is able to detect a notch and the central position in a wafer by a simple configuration without preparing a space for disposing a position detecting mechanism. ! SOLUTION: A processing device comprises: a chuck table holding a wafer 11 having a notch in its periphery; a holding hand 28 that carries out a wafer from a cassette 12; and carrying means that carries a wafer to the chuck table. The processing device includes: imaging means 44 by which the wafer carried out from a cassette is imaged while held by the holding hand and an image of the wafer including the notch is obtained; calculating means for calculating the angle of the wafer held by the holding hand, from a predetermined direction of the notch of the wafer; and control means for controlling the rotation angle of the chuck table rotated around a rotation axis orthogonal to a holding surface. The control means rotates the chuck table as required such that the notch of the wafer held on t
申请公布号 JP2015119003(A) 申请公布日期 2015.06.25
申请号 JP20130260534 申请日期 2013.12.17
申请人 DISCO ABRASIVE SYST LTD 发明人 GO TAKESHI ; SON GYOSEI ; YANG YUNFENG
分类号 H01L21/68;H01L21/301;H01L21/677 主分类号 H01L21/68
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