发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
摘要 A method of manufacturing a semiconductor device includes performing a cycle a predetermined number of times, the cycle including supplying a first precursor containing a specific element and a halogen group to form a first layer and supplying a second precursor containing the specific element and an amino group to modify the first layer into a second layer. A temperature of the substrate is set such that a ligand containing the amino group is separated from the specific element in the second precursor, the separated ligand reacts with the halogen group in the first layer to remove the halogen group from the first layer, the separated ligand is prevented from being bonded to the specific element in the first layer, and the specific element from which the ligand is separated in the second precursor is bonded to the specific element in the first layer.
申请公布号 US2015179427(A1) 申请公布日期 2015.06.25
申请号 US201514638396 申请日期 2015.03.04
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 HIROSE Yoshiro;SANO Atsushi;HARADA Katsuyoshi
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device, the method comprising: (a) forming a seed layer consisting of a specific element on a substrate by performing a cycle a predetermined number of times, the cycle comprising: supplying a first precursor containing the specific element and a halogen group to the substrate to form a first layer containing the specific element and the halogen group; andsupplying a second precursor containing the specific element and an amino group to the substrate to modify the first layer to form a second layer, the second precursor containing one amino group in each molecule of the second precursor; and (b) forming a thin film consisting of the specific element on the seed layer by supplying a third precursor containing the specific element.
地址 Tokyo JP
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