| 发明名称 |
METHOD OF REMOVING WASTE OF SUBSTRATE AND WASTE REMOVING DEVICE THEREOF |
| 摘要 |
According to an exemplary embodiment of the disclosure, a method of removing a waste part of a substrate is provided. The method includes: using a laser to partially drill the substrate to define the waste part; and applying megasonic vibration to the substrate to remove the waste part from the substrate. |
| 申请公布号 |
US2015174700(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201314138181 |
申请日期 |
2013.12.23 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
发明人 |
CHO CHIN-YI;TENG YI-CHUAN;TSAI SHANG-YING;HUNG LI-MIN;HUANG YAO-TE;PENG JUNG-HUEI |
| 分类号 |
B23K26/36 |
主分类号 |
B23K26/36 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of removing a waste part of a substrate, comprising:
using a laser to partially drill the substrate to define the waste part; and applying megasonic vibration to the substrate to remove the waste part from the substrate. |
| 地址 |
Hsinchu TW |
