发明名称 Electronics package with radial heat sink and integrated blower
摘要 An electronics package (10) includes an enclosure (50) and one or more thermal energy generating components disposed in the enclosure (50). A radial heat sink (24) is disposed in the enclosure (50) including a blower (28) disposed in the radial heat sink (24) and a plurality of fins (34) extending from a periphery of the blower (28) toward a perimeter (38) of the radial heat sink (24). The plurality of fins (34) define a plurality of channels (40) having a plurality of channel exits at the perimeter (38) of the radial heat sink (24). The radial heat sink (24) is configured to dissipate thermal energy from the one or more components (14, 16, 18, 20, 22) which are arranged around the heat sink (24) according to heat flux requirements of each component. The radial heat sink (24) has areas (42) of relatively high flux capacity for receiving components having relatively high heat flux requirements and areas (44) of relatively low flux capacity for receiving components having relatively low heat flux requirements.
申请公布号 EP2427037(A3) 申请公布日期 2015.06.24
申请号 EP20110179658 申请日期 2011.08.31
申请人 HAMILTON SUNDSTRAND CORPORATION 发明人 KASLUSKY, SCOTT F.;ST. ROCK, BRIAN
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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