SUBSTRATE PROCESSING APPARATUS

摘要

Disclosed is a substrate processing apparatus. The substrate processing apparatus according to the present invention having a second plate installed in a diffusion space which is a space between a lead and a first plate supported by a support member to be prevented from drooping. Then, the distance between the lead and the second plate and the distance between the second plate and the first plate are uniform respectively, thereby having a uniform process gas sprayed from the second plate. Therefore, the process gas sprayed from the first plate can be more uniform to have an effect of forming a uniform film on the substrate.