| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which permits microfabrication owing to a superior tack-free property of a coating film after drying and photosensitivity, which gives a cured film with excellent flexibility, flame retardancy and electrical insulation reliability, and which causes a small warpage to a substrate after curing, and to provide a resin film, an insulating film and a printed wiring board with an insulting film. <P>SOLUTION: A photosensitive resin composition includes at least: (A1) a resin including substantially no radical polymerizable group in a molecule and including a urethane bond and a carboxyl group; (A2) a resin including a radical polymerizable group in a molecule as well as including a urethane bond; (B) cross-linked polymer particles; (C) a thermosetting resin; and (D) a photopolymerization initiator. <P>COPYRIGHT: (C)2013,JPO&INPIT |
