| 摘要 |
<p>According to one embodiment, a signal transmission circuit includes a semiconductor (30), a multilayer board (20), and a heat radiating plate ground (10). The semiconductor (30) includes a first connection terminal and a second connection terminal. The multilayer board (20) through which a hole to mount the semiconductor (30) is formed includes a transmission path (24), an inner layer ground (23), an outer layer ground (21) and a plate portion (26). The plate portion (26) is formed by plating a part of an inner wall of the hole and extends from the inner layer ground (23) to the outer layer ground (21). The heat radiating plate (10) ground is attached to the outer layer ground (21) and connected to the second connection terminal.</p> |
