发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER |
摘要 |
<p>The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.</p> |
申请公布号 |
EP1909142(B1) |
申请公布日期 |
2015.06.24 |
申请号 |
EP20060732022 |
申请日期 |
2006.04.18 |
申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
YUBA, TOMOYUKI;FUJITA, YOJI;TOMIKAWA, MASAO |
分类号 |
G03F7/085;C08K5/544;G03F7/075 |
主分类号 |
G03F7/085 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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