发明名称 処理室割当設定装置及び処理室割当設定プログラム
摘要 Provided is a method that may quickly and simply select the allocation of the type of wafers to the processing chamber having a higher productivity in a semiconductor processing device in which a plurality of conveyance robots is disposed in a conveyance mechanism to which a processing chamber is connected and an object to be processed is delivered between the plurality of conveyance robots, when processings are performed on a plurality of types of wafers in parallel. From the information on the arrangement of the processing chambers of the semiconductor processing device and input type of wafers to be processed, the processing chamber allocation candidate is comprehensively generated and a simulation that manufactures all processing targets for each of the processing chamber allocation candidates is performed to calculate a productivity and the candidates are displayed in the order from a higher productivity to support the adoption of a user.
申请公布号 JP5738796(B2) 申请公布日期 2015.06.24
申请号 JP20120089849 申请日期 2012.04.11
申请人 株式会社日立ハイテクノロジーズ 发明人 仲田 輝男;野木 慶太;井上 智己
分类号 H01L21/02;H01L21/677 主分类号 H01L21/02
代理机构 代理人
主权项
地址